Shoe Material Effects on Foot Temperature During Treadmill Running
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Authors
Poss, Erin M.
Austin, Brogan L.
Baumgardner, Gwendolyn J.
Budden, Nicholas M.
Campbell, Shauna-Kaye V.
Carlson, Samantha J.
Drake, Ty C.
Eckman, Guy M.
Lawrence, Kelly L.
Nelson, Holly M.
Issue Date
2011-04-19T19:16:46Z
Type
Presentation
Language
en_US
Keywords
Athletic shoes--Materials , Foot--Temperature , Treadmill exercise
Alternative Title
Abstract
Running shoes are made from a variety of materials such as leather or mesh. Material type and assembly
likely impact on foot heat dynamics during running. The purpose of this study was to investigate
how foot temperature during running was modulated by different shoes. All protocols were approved
by the Drake IRB (ID 2009-10088). Eleven male subjects (21.6 ± 1.7 yrs) completed four 10-minute
running trials at self-selected but constant speeds on a treadmill in four different running shoes (two
mesh and two leather). Foot temperature was recorded at two sites on top of the right foot arch
(against the skin and between the sock and shoe) for the 10 minutes during running and 5 minutes of
resting recovery post-running. Heart rate and subjective ratings of perceived comfort and heat were
recorded throughout. There were no statistical differences in foot heat accumulation during running
between the shoes. During the 5 minutes post-exercise, three of the shoe models accommodated heat
dissipation whereas foot temperature in the fourth model significantly increased during rest (all
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p<0.031). Temperature was always greater at the skin site versus the sock site, but fluctuation patterns
between the two sites were congruent. Subjects rated the mesh shoes as more comfortable than the
leather shoes (p=0.016); curiously, however, there were no differences in heat perception across shoes
(p=0.184). These results suggest that (a) shoe material influences foot heat dynamics during and immediately
after running and (b) subjects’ perceptions of foot temperature may not coincide with actual
foot temperature.
Description
Mentor: David S. Senchina